Browse Prior Art Database

Quadpack Handling/ Mass Device

IP.com Disclosure Number: IPCOM000121778D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Boll, SE: AUTHOR

Abstract

Disclosed is a device that allows hand placement of quadpacks with KOVAR* lids on printed wiring boards for vapor phase solder attachment. It solves the placement problems of limited positional control, lead damage from using rigid placement devices, and misalignment caused when adding the weight required for vapor phase soldering to the quadpack lid.

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Quadpack Handling/ Mass Device

      Disclosed is a device that allows hand placement of
quadpacks with KOVAR* lids on printed wiring boards for vapor phase
solder attachment.  It solves the placement problems of limited
positional control, lead damage from using rigid placement devices,
and misalignment caused when adding the weight required for vapor
phase soldering to the quadpack lid.

      Spring loaded shock absorber 2 is extended from the base of the
device and centered on the KOVAR quadpack lid. Device handle 1 is
lowered to the KOVAR quadpack lid 3 which engages button magnet 6
with the KOVAR quadpack lid 3.

      By lifting the handle 1, the suspended captive quadpack 4 can
be placed on the printed wiring board with these advantages:
      o    The device permits rotational and X, Y, Z axis control
during placement.
      o    The sum of the weights of the quadpack 4 and all floating
device components is not large enough to deform the quadpack leads
during board contact.
      o    The floating action provided by the floating button magnet
6 allows the quadpack to self-level during placement, and prevents
lead damage by rigid placement.
      o    The handle 1 is lowered to the quadpack lid 3 after
placement.  The total device weight equals that required on the
quadpack 4 for vapor phase solder attachment.
*  Trademark of Westinghouse Electric Corp.