Browse Prior Art Database

Individual Chip Separation Device

IP.com Disclosure Number: IPCOM000121804D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Related People

Busacco, RA: AUTHOR [+3]

Abstract

Disclosed is a device to discretely remove a semiconductor chip which has been previously bonded to a substrate or card. The technique utilizes the use of the device and a furnace reflow process. Figure 1 shows the device in various positions ranging from Disengaged, Engaged, and Lift-Off.

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Individual Chip Separation Device

      Disclosed is a device to discretely remove a semiconductor chip
which has been previously bonded to a substrate or card.  The
technique utilizes the use of the device and a furnace reflow
process.  Figure 1 shows the device in various positions ranging from
Disengaged, Engaged, and Lift-Off.

      The device is made of spring steel or similar material which
retains its elasticity at chip join temperatures.  By design, its
shape is constructed such that tabs are located at strategic areas of
the device so that when the device is compressed downward against the
substrate the tabs fit underneath the chip, which prevents the device
from expanding back to its original shape.

      The characteristic force of the spring of the device is chosen
to counteract the force due to surface tension of the bond and the
weight of the chip.

      When the chip bond is reflowed to a point where the bond is
less than the counteracting upward force of the device, then a
lift-off action results.

      Disclosed anonymously.