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Heatsink Booster Vane

IP.com Disclosure Number: IPCOM000121805D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 29K

Publishing Venue

IBM

Related People

Lamb, CR: AUTHOR [+2]

Abstract

Disclosed is a thin vane is mounted on the top portion of the heatsink fins at the approximate midpoint of the fin length (see Fig. 1). The vane is perpendicular to the fin and cooling air stream. By adjusting the angle of the vane with respect to the air flow, air which is starting to rise out of the channel is redirected back into the channel until it exits at the end of the heatsink. The vane angle is set to as flat a position as possible in order to minimize its effect on air flow impedance. A single vane is all that is needed for channels up to 7" in length.

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Heatsink Booster Vane

      Disclosed is a thin vane is mounted on the top portion of the
heatsink fins at the approximate midpoint of the fin length (see Fig.
1).  The  vane is perpendicular to the fin and cooling air stream.
By adjusting the angle of the vane with respect to the air flow, air
which is starting to rise out of the channel is redirected back into
the channel until it exits at the end of the heatsink.  The vane
angle is set to as flat a position as possible in order to minimize
its effect on air flow impedance.  A single vane is all that is
needed for channels up to 7" in length.

      This idea was tested and found to reduce Rext (thermal
resistance from the heatsink to the air) by 24% through the air flow
range of 1.5 - 3.0 m/s.  Multiple vanes were tested but did not
significantly improve the heat transfer over the single vane.

      Disclosed anonymously.