Browse Prior Art Database

Method for Densification of Dielectric Material

IP.com Disclosure Number: IPCOM000121815D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 40K

Publishing Venue

IBM

Related People

Czebiniak, TJ: AUTHOR [+4]

Abstract

Disclosed is a method for densification of dielectric material. This method modifies the lay-up of material prior to the lamination process and yields twice the number of panels with fewer process steps. The process flows are outlined below with a cross section of one panel as it appears coming out of the process sector.

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Method for Densification of Dielectric Material

      Disclosed is a method for densification of dielectric material.
This method modifies the lay-up of material prior to the lamination
process and yields twice the number of panels with fewer process
steps.  The process flows are outlined below with a cross section of
one panel as it appears coming out of the process sector.

      The new process flow is successful because the dielectric is
larger in dimensions than the inner metal sheets.  During the
lamination process, the dielectric flows together to form a seal
around the metal sheets for protection through the etch process.  The
bead of dielectric is subsequently trimmed from the edges and the
panels are peeled apart.  In using this method, processes following
lamination are eliminated, the capacity of the lamination press is
doubled and cycle time is reduced.

      Disclosed anonymously.