Browse Prior Art Database

Molding of Conductive Material on Skin of Parts Requiring Electro-magnetic Shielding

IP.com Disclosure Number: IPCOM000121827D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 34K

Publishing Venue

IBM

Related People

Highum, EA: AUTHOR [+3]

Abstract

Disclosed is a method of molding a conductive material in plastic parts for EMC (Electro-Magnetic Compatibility) shielding using the coinjection molding process. The coinjection molding process is a method of molding two materials simultaneously which produces a wall with a core and skin on either side of the core (see the figure).

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Molding of Conductive Material on Skin of Parts Requiring Electro-magnetic
Shielding

      Disclosed is a method of molding a conductive material in
plastic parts for EMC (Electro-Magnetic Compatibility) shielding
using the coinjection molding process.  The coinjection molding
process is a method of molding two materials simultaneously which
produces a wall with a core and skin on either side of the core (see
the figure).

      This method is to mold the conductive material on the skin of
the part with a compatible unfilled material in the core which will
relax the design considerations.

      Disclosed anonymously.