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Improved Solderability for Fluxless SMT Attach

IP.com Disclosure Number: IPCOM000121843D
Original Publication Date: 1991-Sep-01
Included in the Prior Art Database: 2005-Apr-03
Document File: 1 page(s) / 28K

Publishing Venue

IBM

Related People

Horton, RR: AUTHOR [+8]

Abstract

It has been shown that to replace an SMT component on a circuit board a HAT (Hot Air Thermode) can place the component and reflow the solder. The pretinned nature of commercially available SMT components does not allow for the desirable wetting characteristics exhibited by TAB frames having Au plating. While flux can enhance the solder fillet formation, it adds many manufacturing steps to be considered.

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This is the abbreviated version, containing approximately 100% of the total text.

Improved Solderability for Fluxless SMT Attach

      It has been shown that to replace an SMT component on a circuit
board a HAT (Hot Air Thermode) can place the component and reflow the
solder. The pretinned nature of commercially available SMT components
does not allow for the desirable wetting characteristics exhibited by
TAB frames having Au plating. While flux can enhance the solder
fillet formation, it adds many manufacturing steps to be considered.

      The process proposed is a batch processing technique that
starts by taking as received components and dipping in a preclean
solution of 10% HCl followed by a thorough rinse. The pretinned
surfaces are activated by immersion in a solution of PdCl. The
components were then plated for a suitable time in a commercially
available electroless Au bath which allowed for improved wetting
characteristics during solder reflow.

      Disclosed anonymously.