Browse Prior Art Database

Metal Chip Component for Wirebonding Pad

IP.com Disclosure Number: IPCOM000121912D
Original Publication Date: 1991-Oct-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 46K

Publishing Venue

IBM

Related People

Katoh, T: AUTHOR [+3]

Abstract

Disclosed is a method to eliminate surface treatment like a plating or a coating on bonding pads for wirebonding.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 98% of the total text.

Metal Chip Component for Wirebonding Pad

      Disclosed is a method to eliminate surface treatment like
a plating or a coating on bonding pads for wirebonding.

      Wirebonding is a widely used technique to connect between
separated pads with the fine metal wire. Fig. 1 shows a typical
wirebond for semiconductor device connection.  One problem faced in
the wirebonding is needing surface treatment if the pad material is
not bondable. Gold plating, aluminum plating, or nickel plating are
commonly used as surface treatments. However, such surface treatment
is made only for wirebonding and increases process cost.

      This article suggests a novel wirebonding process using metal
chip components instead of surface treatments. Fig. 2 shows a typical
structure of wirebond using the metal chip component disclosed
herein.  A typical process sequence includes:
1.   Semiconductor devices and metal chip components are mounted to
the printed circuit board.
2.   Connection between bonding pad and metal chip component is done
by conductive adhesive or brazing in the same manner of semiconductor
die bonding.
3.   Wirebonding is carried out between the semiconductor device and
metal chip component.

      The use of a metal chip component eliminates special surface
treatment for wirebonding pad on printed circuit board. Mounting and
connecting of the metal chip component is done at the same time of
semiconductor mounting and connecting. Therefore, this process
r...