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Browse Prior Art Database

Direct Patterning of Polyimide

IP.com Disclosure Number: IPCOM000121976D
Original Publication Date: 1991-Oct-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 79K

Publishing Venue

IBM

Related People

Dimitrakopoulos, C: AUTHOR [+2]

Abstract

Disclosed is a one-step dry process for directing patterning of polyimide using a vapor deposition process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Direct Patterning of Polyimide

      Disclosed is a one-step dry process for directing
patterning of polyimide using a vapor deposition process.

      Polyimide films can be grown by vapor deposition methods [*].
Patterned polyimide structure can be achieved by performing the
deposition through a mask.  An example is shown in the figure, where
polyimide has been deposited from co-deposition of the monomers
1,2,4,5-benzenetetracarboxylic anhydride and 4,4'-oxydianiline in
stoichiometric amounts with thermal cure of 400oC to form the
patterned polyimide (poly(4,4'-oxydiphenylenepyromellitimide)).
Using other monomers, different polyimides could be patterned.  This
is essentially a one-step process; other methods of patterning
polyimide, even using photosensitive polyimides, require many steps.
This technique is particularly suitable for post-processing
engineering changes, such as repairs where a localized dielectric
layer is required.

      Reference
(*)  J.R. Salem, F.O. Sequeda, J. Duran, W.Y. Lee and R.M. Yang, J.
Vac . Sci. Technol. A4, 369 (1986).