Browse Prior Art Database

Curvature Enhanced Jet Cooling for Chips with Heat Sinks

IP.com Disclosure Number: IPCOM000122067D
Original Publication Date: 1991-Oct-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 54K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

A means to cool high power integrated circuit chips utilizing a curved heat sink and an impinging liquid jet delivered through a piston is shown in the figure. A silicon chip 8 or arrays of chips are mounted on a substrate 9. Attached to each chip 8 is a curved heat sink 7 which may be fabricated of molybdenum, silicon carbide, or silicon to accommodate the thermal expansion characteristics of the silicon chip. The center of the heat sink has a hemispherical depression into which projects a piston 4 with a centrally located flow passage 3. The piston is contained in a circular well 12 within the module housing 10 and is maintained in contact with the hat sink 7 by the force of a spring 5.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 78% of the total text.

Curvature Enhanced Jet Cooling for Chips with Heat Sinks

      A means to cool high power integrated circuit chips utilizing a
curved heat sink and an impinging liquid jet delivered through a
piston is shown in the figure.  A silicon chip 8 or arrays of chips
are mounted on a substrate 9.  Attached to each chip 8 is a curved
heat sink 7 which may be fabricated of molybdenum, silicon carbide,
or silicon to accommodate the thermal expansion characteristics of
the silicon chip.  The center of the heat sink has a hemispherical
depression into which projects a piston 4 with a centrally located
flow passage 3.  The piston is contained in a circular well 12 within
the module housing 10 and is maintained in contact with the hat sink
7 by the force of a spring 5.  A circular hole 2 in the end
of the piston well 12 allows dielectric coolant to flow into the well
from the main plenum 1 which can be designed to supply coolant to
many wells.  The central flow passage 3 in the piston is sufficiently
large, compared to the annulus 13 between the surface of the piston
and the surrounding walls of the well, that coolant will flow
preferentially through the passage and provide a jet impinging upon
the hemispherical surface of the heat sink 14.  Spacing bumps 6 are
provided on the surface of the piston to provide a flow channel to
allow coolant to flow over the hemispherical heat sink surface 14 and
then exhaust.  Heat transfer may be by means of convection without
phase change, o...