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A Hybrid Immersion Cooling Scheme for Memory Cubes and High Power Logic Chips on the Same Substrate

IP.com Disclosure Number: IPCOM000122072D
Original Publication Date: 1991-Oct-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 44K

Publishing Venue

IBM

Related People

Chu, RC: AUTHOR [+2]

Abstract

A means to cool high power logic chips and memory cubes mounted on the same substrate is shown in the drawing. High power logic chips 4 are mounted in a planar fashion on a substrate 7. Mounted around the perimeter on the same substrate are stacks of memory chips formed into a memory cube 5. Attached to the substrate is a protective casing and cooling housing 8. Dielectric coolant is supplied to the housing through a centrally located port 1. Coolant is distributed by means of a common plenum 2 to individual plenums 3 situated opposite to each high power logic chip 4. Each individual plenum 3 contains appropriately sized orifices 9 to provide liquid jets impinging upon the high power logic chips in order to achieve a high rate of heat removal.

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A Hybrid Immersion Cooling Scheme for Memory Cubes and High Power
Logic Chips on the Same Substrate

      A means to cool high power logic chips and memory cubes mounted
on the same substrate is shown in the drawing.  High power logic
chips 4 are mounted in a planar fashion on a substrate 7.  Mounted
around the perimeter on the same substrate are stacks of memory chips
formed into a memory cube 5.  Attached to the substrate is a
protective casing and cooling housing 8.  Dielectric coolant is
supplied to the housing through a centrally located port 1.  Coolant
is distributed by means of a common plenum 2 to individual plenums 3
situated opposite to each high power logic chip 4. Each individual
plenum 3 contains appropriately sized orifices 9 to provide liquid
jets impinging upon the high power logic chips in order to achieve a
high rate of heat removal.  The internal structure of the cooling
housing is shaped to cause the exhaust coolant to wash over the
memory cubes 5 prior to exiting the housing.  By proper sizing of the
open space around the cubes 5, sufficient flow velocity is provided
to create a mixed convection flow regime adequate for heat removal
from the memory cubes.  Exhaust flow ports 6 are provided at both
ends of the cooling housing 8 to ensure uniform flow and cooling
conditions at each end of the substrate.

      Disclosed anonymously.