Browse Prior Art Database

Impingement Cooling Board (ICB)

IP.com Disclosure Number: IPCOM000122074D
Original Publication Date: 1991-Oct-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 51K

Publishing Venue

IBM

Related People

Eid, JC: AUTHOR [+2]

Abstract

Cooling of typical card-on-board technologies used in computers has been primarily by convection of air past the heat-producing devices. As the computer's speed increases, the cards and frames are becoming more densely packed which results in poor flow distribution of the coolant air. The figures show two embodiments of an Impingement Cooling Board. Figure 1 shows chips 1, located on both sides of card 2, attached to a board 3. An optional seal 4, isolates the chip from the ambient environment. The seal could be from capping the chip within a carrier (not shown) or be a flexible membrane as shown. Attached to the seal and/or chip is a heat sink 5. A small supply manifold 6, with impingement holes 7, is located near the chips and heat sink. The manifold distributes air or any desired coolant to the distinct heat sources.

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Impingement Cooling Board (ICB)

      Cooling of typical card-on-board technologies used in computers
has been primarily by convection of air past the heat-producing
devices.  As the computer's speed increases, the cards and frames are
becoming more densely packed which results in poor flow distribution
of the coolant air.  The figures show two embodiments of an
Impingement Cooling Board.  Figure 1 shows chips 1, located on both
sides of card 2, attached to a board 3.  An optional seal 4, isolates
the chip from the ambient environment.  The seal could be from
capping the chip within a carrier (not shown) or be a flexible
membrane as shown.  Attached to the seal and/or chip is a heat sink
5.  A small supply manifold 6, with impingement holes 7, is located
near the chips and heat sink.  The manifold distributes air or any
desired coolant to the distinct heat sources.  The small impingement
holes provide for the forced cool air to impinge on the heat
sinks/sources at the desired velocity.  The quantity, size and
location of the holes is determined from the size and power level of
the chip.  The small ducts enable cool inlet air to be supplied
precisely where required and eliminates the uncertainty of flow
distribution under conditions in which all cards and/or components
are not present for a given customer's configuration.

      Figure 2 illustrates the Impingement Cooling Board concept
applied to a multilayer ceramic module with the chips attached on one
...