Browse Prior Art Database

Novel Solder Array Module Rework/ Tool

IP.com Disclosure Number: IPCOM000122101D
Original Publication Date: 1991-Oct-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 35K

Publishing Venue

IBM

Related People

Hernandez, B: AUTHOR [+6]

Abstract

When repairing a multi-chip module which utilizes an area array of solder balls for I/O and mechanical attachment to a board it is imperative that the removal technique not disturb neighboring components or the board. The invention described here removes modules with the minimum heat required to melt part of the solder connections. It does this without timing devices as gravity is employed for removal after the solder has become molten. Board warpage is held to a minimum as no external forces are used to effect removal.

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Novel Solder Array Module Rework/ Tool

      When repairing a multi-chip module which utilizes an area array
of solder balls for I/O and mechanical attachment to a board it is
imperative that the removal technique not disturb neighboring
components or the board.  The invention described here removes
modules with the minimum heat required to melt part of the solder
connections.  It does this without timing devices as gravity is
employed for removal after the solder has become molten.  Board
warpage is held to a minimum as no external forces are used to effect
removal.

      The circuit board having the module to be removed is placed so
that the module is facing down and in close alignment to the removal
tool.  The circuit board is supported and the tool having an integral
vacuum port and feedback controlled heater assembly is raised on an
air cylinder until contact with the module is established.  The
vacuum is switched on, power supplied to the heater, and the air
cylinder is returned to the rest position.  When the melting
temperature of the solder is reached, the removal tool, along with
the module, drop the short distance to the air cylinder.

      Disclosed anonymously.