Browse Prior Art Database

Opto-Electronic Package for Enhanced Electrostatic Discharge Performance System

IP.com Disclosure Number: IPCOM000122250D
Original Publication Date: 1991-Nov-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 92K

Publishing Venue

IBM

Related People

Dreps, DM: AUTHOR [+4]

Abstract

Disclosed is a manufacturing process for obtaining effective electrostatic discharge (ESD) and RF shielding of modular-constructed fiber- optic modules.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Opto-Electronic Package for Enhanced Electrostatic Discharge Performance
System

      Disclosed is a manufacturing process for obtaining
effective electrostatic discharge (ESD) and RF shielding of
modular-constructed fiber- optic modules.

      The preferred embodiment of an optoelectronic package for
enhanced ESD performance is shown in the figure.  As shown, the
fiber-optic module has been designed for automated assembly and
manufacturing.  The module consists of several individual
sub-assemblies that are stackable in nature and, when connected
together, form the final assembly. However, the original module
design did not have a complete ESD/electrical shield or good
electrical connections between the various sub-assemblies to make an
effective ESD/electrical shield.  In addition, several areas of the
module lacked any shielding at all.  To solve both the overall ESD/RF
shielding problem and the directly related manufacturing problems
associated with the existing modular module construction required a
new multiple connection solution.

      As shown in Fig. 1, the substrate 1 with an internal copper
shield 2 was placed into the lower half of the aluminum module
housing 4.  The electrical input/output signal, ground and power pins
9 protrude through the bottom opening of the aluminum housing 4 and
make contact to a support card (not shown).  To shield this area, a
thin metallized copper shield is deposited on the bottom side of the
substrate 7, solder tinned and then soldered to a similarly plated
and tinned area around the peripheral of the housing opening 8.  An
alternative discrete copper shield can also be used in place of the
plated bottom side substrate shield.  With the discrete shield, the
I/O substrate ground pins 9 are soldered, wire bonded, or welded to
the copper shield or plane.

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