Browse Prior Art Database

Load Modules for Electron-Beam Probe Stations

IP.com Disclosure Number: IPCOM000122270D
Original Publication Date: 1991-Nov-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 42K

Publishing Venue

IBM

Related People

Jacquou, A: AUTHOR [+2]

Abstract

Electron-beam probe stations are usually designed to handle a variety of packaging types of various sizes and pin configurations; the handling is performed by constructing a new load module for each new type.

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Load Modules for Electron-Beam Probe Stations

      Electron-beam probe stations are usually designed to
handle a variety of packaging types of various sizes and pin
configurations; the handling is performed by constructing a new load
module for each new type.

      With the rapid evolution of semiconductor industry, new
packaging types appear constantly, making the process of constructing
new load modules long and expensive.

      This article describes a load module allowing for fast and
cheap adaptation to any packaging type.

      As shown in the figure, the device under test 1 resides in a
vacuum chamber. The electron-beam probe station comprises parts 7, 8,
and 9.  A head mechanism 8 is removable under control of the probe
station. Pins 7 ensure electrical contact between leads carrying
stimulating signals for the device under test and conductive lands on
the surface of printed circuit 5.

      A plate 10, featuring an opening in its middle of a size
sufficient to handle future packaging type sizes, is shown in the
figure.

      Stimulating signals are transmitted through components 6,
either surface mounted or not, pins 4 and socket 2 to the device
under test.  Vacuum is ensured through the use of gaskets 3.

      Adaptation of each component is simply done by replacing
components 6.

      Adaptation to any new packaging type is simply done by
replacing printed circuit 5, socket 2 and, if necessary, components
6.