Browse Prior Art Database

Contactless Connection for High I/O Silicon Integrated Circuit Chips

IP.com Disclosure Number: IPCOM000122306D
Original Publication Date: 1991-Nov-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 52K

Publishing Venue

IBM

Related People

Schrottke, G: AUTHOR [+3]

Abstract

A method is described which eliminates conventional bonding techniques for communication between integrated circuit chips and the next level of assembly. This method uses light for the communication medium.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 78% of the total text.

Contactless Connection for High I/O Silicon Integrated Circuit Chips

      A method is described which eliminates conventional bonding
techniques for communication between integrated circuit chips and the
next level of assembly.  This method uses light for the communication
medium.

      When fabricating the circuit chip, an array of photo detector
transistors and light emitting diodes (LED) are included, typically
and preferably on the periphery but they may be designed to be
anywhere on the device, as an area array pattern.  These devices
would be formed when the rest of the chip's circuits are built, so
only minimal additional processing is required.  The photo detector
transistors act as inputs to the chip, and the LED's act as outputs.
These physically small devices can be formed with very high precision
relative to a reference datum on the chip edge and add little
additional size to the chip.

      To contact the chip to the next level package, one would simply
position the chip such that the LED's and photodetectors on the chip
align to a matching array of LED's and detectors on the next level
package. Communication of information between devices is achieved
through transfer of light signals rather than electrical signals
through wires.

      Conventional soldering or wire bonding techniques could be used
for power connection although the preferred method would be achieved
by pressure contact to large pads on the chip.

      Fiber optic str...