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Browse Prior Art Database

Solder Removal Process for Solder Deposition Device

IP.com Disclosure Number: IPCOM000122307D
Original Publication Date: 1991-Nov-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 41K

Publishing Venue

IBM

Related People

Dillion, TE: AUTHOR [+2]

Abstract

Disclosed is a tool/process for removing molten solder from the reservoir of a molten solder application tool.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Solder Removal Process for Solder Deposition Device

      Disclosed is a tool/process for removing molten solder from the
reservoir of a molten solder application tool.

      Formerly, the removal of molten solder from the tool was done
by evacuating the molten solder from the tool through a small heated
tube located in the side of the soldering nozzle.  The molten solder
was then passed through a solder trap, which solidified and collected
the solder and then removed the flux and lead fumes from the exhaust
with a filter.

      The previous method created many problems and was unreliable.
The small heated tube had to be kept at high temperatures (600
degrees C) to keep the solder molten during evacuation.  This tube
was prone to clogging and the high temperature posed additional
material and safety problems.

      The new method of solder removal, which is the invention
described in this paper, replaces the evacuation system with a
positive pressure solder expulsion system. This method takes
advantage of a redesigned solder nozzle which has an inlet whereby
pressurized gas (air or nitrogen) may be injected into the solder
nozzle above the molten solder.  The molten solder is expelled out of
the nozzle into a solder waste receptacle.  The solder waste
receptacle may be connected to standard fume exhaust ducts, such as
those used for hand soldering, to remove flux and solder fumes.

      Disclosed anonymously.