Browse Prior Art Database

Low Melt Solder Preform for Chip Attach

IP.com Disclosure Number: IPCOM000122327D
Original Publication Date: 1991-Nov-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Funari, J: AUTHOR [+2]

Abstract

This disclosure describes a process for discretely placing a solder preform or solder slug anywhere on a substrate's surface. The slug adheres to the substrate's surface by the use of a dry film of flux, acting as a glue.

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This is the abbreviated version, containing approximately 100% of the total text.

Low Melt Solder Preform for Chip Attach

      This disclosure describes a process for discretely placing a
solder preform or solder slug anywhere on a substrate's surface.  The
slug adheres to the substrate's surface by the use of a dry film of
flux, acting as a glue.

      As shown in the figure, a spring loaded punch (1), is driven
through a solder foil (2), forming a slug of solder, cut by die (3).
The slug (6) is pressed onto the dry flux (5) gluing the slug onto
the substrate (4).  The punch is then retracted and the solder foil
and substrate indexed to repeat the cycle.

      Disclosed anonymously.