Browse Prior Art Database

Substrate Levelling and Flattening Fixture

IP.com Disclosure Number: IPCOM000122328D
Original Publication Date: 1991-Nov-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Long, DC: AUTHOR [+2]

Abstract

Warped substrates can cause problems in the manufacturing of high performance electronic circuits. This invention describes a substrate levelling and flattening fixture which can be integrated with a surface flatness measurement system for automatic operation.

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Substrate Levelling and Flattening Fixture

      Warped substrates can cause problems in the manufacturing of
high performance electronic circuits.  This invention describes a
substrate levelling and flattening fixture which can be integrated
with a surface flatness measurement system for automatic operation.

      As shown in Figures 1 and 2, the substrate 1, is supported at
multiple points by a matrix of linear actuators 2 (such as motor
driven micrometer heads).  A vacuum pump 5, creates a vacuum plenum
3, with flexible seal 4, provides a means for atmospheric pressure to
press the substrate 1, against the actuators 2.  The actuators 2 are
adjusted to push up the low spots 6, to be level with the high spots
7.

      Adjustment is performed a number of times to produce optimum
levelling and flattening of the top surface of the substrate 1.  The
linear actuators 2, can be adjusted automatically by a computer
system integrated with a surface flatness measuring system.

      This device can flatten and level substrates 1, to provide
sharp focus in optical exposure, inspection, and laser machining
processes.  This device can also be used to produce uniform metallic
and dielectric films, by flattening the substrate 1, during the
grinding, lapping, or machining of deposited films on the top surface
of the substrate. This yields improved uniformity of electrical
performance required for high-speed switching circuits.

      Disclosed anonymously.