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System of Patterned Transfer of Copper with Resistive Heating Using Simplified Transfer Material and Dedicated Stylus

IP.com Disclosure Number: IPCOM000122347D
Original Publication Date: 1991-Nov-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 56K

Publishing Venue

IBM

Related People

Afzali-Ardakani, A: AUTHOR [+4]

Abstract

Disclosed is a system and material for the patterned transfer of copper film to Teflon and thermid substrates utilizing resistive heating.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 68% of the total text.

System of Patterned Transfer of Copper with Resistive Heating Using
Simplified Transfer Material and Dedicated Stylus

      Disclosed is a system and material for the patterned transfer
of copper film to Teflon and thermid substrates utilizing resistive
heating.

      In the process of resistive heating metal transfer, localized
heating occurs due to the following resistances in the current path:
the electrode; the resistive layer, i.e., polycarbonate or bulk
polycarbonate; and at the interface of polycarbonate-metal.  To
assure good adhesion between the metal to be transferred and the
polymer substrate to which it is transferred, one has to transfer
enough heat to cause a partial softening of the substrate. Since it
is the heat created at the polycarbonate-electrode interface, due to
contact resistance, that mainly contributes to the undesirable
heating of the polycarbonate, the elimination of this resistance is
of importance to the efficiency of the process.  With the present
system this is achieved by replacing the conventionally used tungsten
electrode with a gold ball, minimizing the resistance at the contact
point.

      The structure of the transfer material is also simplified by
omitting aluminum and using copper, of 300-1500  Angstroms, only.
The advantage of using this structure is that no contaminant metal is
transferred and since the adhesion of the copper to the polycarbonate
is smaller than that of aluminum, easier delamination is attained.
Du...