Browse Prior Art Database

Bidirectional Molten Solder Dressing Tool

IP.com Disclosure Number: IPCOM000122349D
Original Publication Date: 1991-Nov-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 42K

Publishing Venue

IBM

Related People

Hernandez, B: AUTHOR [+4]

Abstract

This invention consists of a custom solder pot having a feedback loop to control the desired temperature of the solder to be used for a specific application. Across the opening of the solder pot and at the level of the solder is an axle connected to a motor capable of variable RPM and rotational direction. On this axle is a stainless steel wheel having a suitable diameter, the surface of which is machined with grooves to increase the contact area. The remaining component is a linear motor-driven slide with the capability to hold and drive the desired component over the rotating wheel in the solder pot.

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Bidirectional Molten Solder Dressing Tool

      This invention consists of a custom solder pot having a
feedback loop to control the desired temperature of the solder to be
used for a specific application.  Across the opening of the solder
pot and at the level of the solder is an axle connected to a motor
capable of variable RPM and rotational direction.  On this axle is a
stainless steel wheel having a suitable diameter, the surface of
which is machined with grooves to increase the contact area.  The
remaining component is a linear motor-driven slide with the
capability to hold and drive the desired component over the rotating
wheel in the solder pot.

      In operation, the solder pot would be brought up to a
temperature above the melting point of the solder.  For the tool to
be used in redressing solders having a high Pb content, 63Sn37Pb
solder will allow a low temperature process to be employed.  The
motor driven wheel is actuated and the wetting action between the
solder and the wheel provides a continuous fresh solder surface.  The
component holder on the linear slide is engaged to hold a chip or
circuit board allowing the component's active area to face the
rotating wheel.  The component is fluxed and driven at a controlled
height above the rotating solder wheel.  The amount of solder left in
the desired area can be influenced by both the velocity of the wheel
rotation and the direction of component travel.

      Disclosed anonymously.