Browse Prior Art Database

Level Gear Drive Belt for Chip Join Furnaces

IP.com Disclosure Number: IPCOM000122422D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 69K

Publishing Venue

IBM

Related People

Eisenmann, DE: AUTHOR [+2]

Abstract

This article discloses a method to prevent vibration during the manufacture of semiconductor multilayer ceramic (MLC) circuit packages using a atmosphere-controlled furnace. Semiconductors and active components are soldered to an appropriate substrate using the controlled chip collapse connection (C4) or solder bump technique.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 52% of the total text.

Level Gear Drive Belt for Chip Join Furnaces

      This article discloses a method to prevent vibration
during the manufacture of semiconductor multilayer ceramic (MLC)
circuit packages using a atmosphere-controlled furnace.
Semiconductors and active components are soldered to an appropriate
substrate using the controlled chip collapse connection (C4) or
solder bump technique.

      Current furnace design uses a drum drive belt system, with side
or edge guides preventing an out of adjustment belt from
sliding/wandering too far to either side. Excessive movement of the
belt could cause damage to the furnace or to the product in the
furnace.  Continued operation of a furnace after belt slippage by
untrained personnel can and does happen.  The furnace belt can get
damaged, as it comes in contact with the side furnace guides.  After
being bent or otherwise damaged when the belt comes in periodic
contact with the side furnace guides during its repetitive cycle
through the furnace, the edge of the belt momentarily stops and then
releases with a vibration transmitted throughout the furnace.  When
this occurs, all the parts in the furnace undergoing solder reflow
will be vibrated.  Those components in the liquidus phase of the
solder reflow, the semiconductors, capacitors, etc., will be vibrated
and thrown off the substrates instead of being joined.

      The new method disclosed enhances the probability that it will
run maintenance/defect-free requiring less manpower support, and at
the same time producing product with higher yields.  The features of
this disclosure are:
1.   Belt Drive S...