Browse Prior Art Database

Chip Design for a Defect Detection Standard

IP.com Disclosure Number: IPCOM000122504D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 93K

Publishing Venue

IBM

Related People

Meresse, M: AUTHOR [+2]

Abstract

Higher circuit densities and circuit performance are driving smaller patterns, vertical integration and large-scale horizontal integration.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 65% of the total text.

Chip Design for a Defect Detection Standard

      Higher circuit densities and circuit performance are
driving smaller patterns, vertical integration and large-scale
horizontal integration.

      Manufacturability, as measured by yields, is a strong function
of defect densities. Developing tools and methods to measure and
track smaller defects and smaller defect densities are a significant
challenge for the future.

      Automatic defect-inspection tools are used for this purpose and
operate by digitizing an image and comparing field of view to field
of view on a chip, or chip to chip. The tool-detection sensitivity
must be determined and monitored at regular intervals to validate the
measurements. For this purpose, a standard wafer with known,
programmed defects is typically used.

      Described below is a special chip designed as a defect standard
that will allow correlation of visual to electrical measurements.

      In order to monitor different chip configurations with respect
to linewidth, contact size and shape and pattern spacing, three basic
blocks are used. Each block is repeated in an array of 4x4 and each
element has defects of different size, shape and proximity. Fig. 1
shows one of the basic blocks with mazes, probe pads and programmed
defects. It is designed as a triple maze with each end terminated by
a pad. This design will be used to form the pattern in a conductive
line: polysilicon, metal or silicide. The padding is consistent wi...