Browse Prior Art Database

Panel Flattener

IP.com Disclosure Number: IPCOM000122507D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Leerssen, AL: AUTHOR [+3]

Abstract

Disclosed is a vacuum fixture for flattening a printed circuit panel/ card when the SMC copper pads are deposited with solder. The flatness of the printed circuit board is very critical during solder application to fine pitch pads.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Panel Flattener

      Disclosed is a vacuum fixture for flattening a printed
circuit panel/ card when the SMC copper pads are deposited with
solder.  The flatness of the printed circuit board is very critical
during solder application to fine pitch pads.

      Figure 1 shows an isometric view of the fixture.  When the
printed circuit panel 2 is placed onto the flattening fixture frame
1, a vacuum is drawn to pull the panel flat. The flattening process
is done by several vacuum cup assemblies, as indicated in section
view A-A.  Each vacuum cup subassembly contains three key parts: post
3, standoff rod 4 and suction cup 5.

      Each standoff rod 4 (inside the vacuum cup) is present at a
fixed height to level and to support the panel underneath.  The
panel/card is then pulled down to a uniform height (flatness) by
vacuum being drawn through each vacuum cup.

      In addition to the vacuum cup assemblies, there are numerous
non-cup standoff rods provided for support where panel design makes
vacuum cups inappropriate.

      Depending on each panel design and its backside component
layout, a tactical arrangement of suction cup assemblies and solid
supports can be made on the predrilled base plate.  This provides a
maximum flexibility and the best combination to tailor a particular
product.