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Stacked Coil for Hard Disk Recording Head

IP.com Disclosure Number: IPCOM000122510D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 64K

Publishing Venue

IBM

Related People

Arai, Y: AUTHOR [+2]

Abstract

Disclosed herein is a coil for a magnetic recording ferrite head used in a hard disk drive. The coil consists of two chips on which multilayer Cu leads and bonding bumps are formed. One chip has regular-size bonding bumps, and the other chip has tall studs on which bonding bumps are formed. These two chips are placed inside and outside of the yoke, respectively, and bonded to each other around the yoke. The coil thus obtained is very small compared with the conventional ferrite head and contributes to reduce an area of the yoke window.

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Stacked Coil for Hard Disk Recording Head

      Disclosed herein is a coil for a magnetic recording
ferrite head used in a hard disk drive. The coil consists of two
chips on which multilayer Cu leads and bonding bumps are formed. One
chip has regular-size bonding bumps, and the other chip has tall
studs on which bonding bumps are formed. These two chips are placed
inside and outside of the yoke, respectively, and bonded to each
other around the yoke. The coil thus obtained is very small compared
with the conventional ferrite head and contributes to reduce an area
of the yoke window.

      An example of the coil structure is shown in Fig. 1.  A chip 1
on which multilayer Cu leads and regular bonding bumps are formed is
inserted into a window 4 of a yoke 5 and bonded to the side wall
of a slider 3. Then the other chip 2 with tall studs is placed face
to  face in front of the former chip and is connected by melting the
low melting point solders which are formed on the top of the studs.

      The multilayer Cu leads are fabricated in the same way as that
of the conventional thin film head. However, fabrication of the tall
studs needs the techniques shown in Fig. 2.  A base metal 7 is
deposited on a substrate 6 on which the multilayer Cu leads are
already formed. A stencil 8 made of organic material is then
fabricated on the base metal 7 using a multilayer resist process
which can make such a high aspect ratio pattern as that shown in Fig.
2. Between the stencil...