Browse Prior Art Database

Tape Lift Off Tool

IP.com Disclosure Number: IPCOM000122567D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 50K

Publishing Venue

IBM

Related People

Brandon, MA: AUTHOR [+5]

Abstract

Disclosed is a tool used for metal removal on ATX-4 wafers. Originally designed for lab use, the tool was retrofit with air motors and air logic controls for use in manufacturing and it is presently utilized on manufacturing lines. This tool eliminated a problem that was caused by the previous chemical lift-off process.

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Tape Lift Off Tool

      Disclosed is a tool used for metal removal on ATX-4
wafers. Originally designed for lab use, the tool was retrofit with
air motors and air logic controls for use in manufacturing and it is
presently utilized on manufacturing lines.  This tool eliminated a
problem that was caused by the previous chemical lift-off process.

      The isometric figure identifies the manual lab tool version.
After a wafer is placed on the vacuum chuck 4, the slide ASM 2 is
actuated forward and tape is unrolled from the tape roll 1.  When the
interlock switch 5 is actuated, the vacuum chuck is raised to meet
the tape height.  The slide ASM 2 is then actuated in reverse,
smoothing down the tape on the wafer by the rubber roller 6.  The
slide ASM actuates a rear interlock switch returning the vacuum chuck
4 to the down position. The hand crank 3 is then rotated
counterclockwise, pulling the tape and unwanted metal off the wafer,
placing it on the take-up roller 7.