Browse Prior Art Database

Structure Generated by the Self Induced Repair Process

IP.com Disclosure Number: IPCOM000122578D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 67K

Publishing Venue

IBM

Related People

Chen, CJ: AUTHOR

Abstract

Disclosed is a structure generated by the self-induced repair (SIR) process, especially the process to repair circuit opens and making customized interconnections using the two-step process. First, a laser pyrolytic direct writing method is used to generate a metal seeding. Secondly, the seeded section is plated up using the principle of constriction-induced local electrodeposition process, described in U.S. Patent 4,919,971.

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Structure Generated by the Self Induced Repair Process

      Disclosed is a structure generated by the self-induced
repair (SIR) process, especially the process to repair circuit opens
and making customized interconnections using the two-step process.
First, a laser pyrolytic direct writing method is used to generate a
metal seeding. Secondly, the seeded section is plated up using the
principle of constriction-induced local electrodeposition process,
described in U.S. Patent 4,919,971.

      The two-step process creates a unique metallurgical structure
which is easily distinguishable from the structures generated by
prior art, such as palladium seeding followed by electroless plating.
In Fig. 1, on substrate 1, the original lines 2, are made of copper
5, capped with another metal 4, e.g., Co, Au, Ni.  A seeded section
3, generated through seeding, is made of palladium 6.  Fig. 2 shows
the structure made by the process of U.S. Patent 4,919,971,
Self-Induced Repair (SIR).  While the seeded section 3 is covered
with copper 7, most of the surface of the original lines 2 remains
intact.  The capping metal 4 is still on the top of the lines.  Fig.
3 shows that structure generated by prior art, palladium seeding
followed by electroless plating.  Not only is the seeded section 3
covered with copper 8, but all the original lines are covered with
copper 8 of the same thickness.  The increase of thickness and width
in the prior art may cause a problem if the thickness...