Browse Prior Art Database

Fine Pitch Parallel Board Connector

IP.com Disclosure Number: IPCOM000122588D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 3 page(s) / 85K

Publishing Venue

IBM

Related People

Antonie, CH: AUTHOR [+2]

Abstract

Disclosed is a concept for providing high-density electrical connections between parallel printed wiring boards. This connector system provides adequate contact wipe and contact stress with a low spring rate, and a low assembly force. These allow high interconnect counts, redundant contacts, and accurate alignment through multiple reconnections. The connector assembly process is relatively simple.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 58% of the total text.

Fine Pitch Parallel Board Connector

      Disclosed is a concept for providing high-density
electrical connections between parallel printed wiring boards.  This
connector system provides adequate contact wipe and contact stress
with a low spring rate, and a low assembly force. These allow high
interconnect counts, redundant contacts, and accurate alignment
through multiple reconnections.  The connector assembly process is
relatively simple.

      Improvements in semiconductor and circuit card assembly
processes allow card designs with increasing complexity and speed.
Electrical connections between functional units are frequently a
limit to further miniaturization.  There is an absence of small, high
density connectors for use between electronic functional islands and
their system boards.

      A curved rod pressed against a plane produces an very small
contact area.  The contact pressure is a function of the contact
materials and dimensions and is distributed parabolically, as shown
in Figure 1.  The connector system shown in Figure 2 consists of many
small diameter wires installed symmetrically within a rigid
insulating carrier. The connector wires extend out toward a pattern
of conductive pads on the inside surfaces of the two circuit cards.
Alignment is maintained by constraining the carrier with the
sidewalls of a supporting frame which occupies the volume between the
circuit cards.

      A compressive force applied normally to the circuit cards
...