Browse Prior Art Database

High Density Parallel Board Connector

IP.com Disclosure Number: IPCOM000122590D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 4 page(s) / 87K

Publishing Venue

IBM

Related People

Antonie, CH: AUTHOR [+2]

Abstract

Disclosed is a concept for providing high density electrical connections between parallel printed wiring boards. The connector geometry provides adequate contact wipe and contact stress with a low spring rate, and a low assembly force.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 65% of the total text.

High Density Parallel Board Connector

      Disclosed is a concept for providing high density
electrical connections between parallel printed wiring boards.  The
connector geometry provides adequate contact wipe and contact stress
with a low spring rate, and a  low assembly force.

      Electronic designs are using advanced chip packaging
technologies (i.e., TAB, flip-chip) to focus increasing functionality
onto small, high precision modules (functional islands).  The modules
are mounted onto a low complexity motherboard, which serves as the
interconnection vehicle. Few commercially available connectors have
the density and features to provide effective connection of the
function modules to the motherboard.

      A conical rod pressed into a circular hole has a very small
annular contact area (Figure 1).  The proposed connector system
consists of a plurality of small diameter wires installed
symmetrically within a rigid insulating carrier.  The wires tips are
given a conical shape having a shallow angle with respect to the wire
axis.  The wire carrier is soldered onto the motherboard, and held in
precise alignment with an added supporting frame which occupies the
volume between the motherboard and functional module (Figure 2).  A
compressive force from the module's heatsink or cover presses the
module's contact vias onto the conical wire tips, creating a wiping
action.  The shallow insertion angle will produce a high contact
stress with a low contact f...