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Slider Bonding Machine and Process

IP.com Disclosure Number: IPCOM000122609D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 3 page(s) / 64K

Publishing Venue

IBM

Related People

Heitkamp, GL: AUTHOR [+3]

Abstract

This article describes a machine and process to accurately dispense and apply for bonding sliders to flexures during head suspension manufacturing.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 96% of the total text.

Slider Bonding Machine and Process

      This article describes a machine and process to
accurately dispense and apply for bonding sliders to flexures during
head suspension manufacturing.

      The machine consists of a dispensing head 1 mounted on a
precision indexing table 2 (see Fig. 1).  A vision system 3 is used
to measure the amount of adhesive dispensed on the tip.  The vision
system also controls all machine functions and sequence.  A blotting
mechanism 4, consisting of a hard tape in a cartridge 5 driven by a
pneumatic indexer 6, is required to move excess adhesive from the
dispensing tip. Periodically, the adhesive is dispensed on the
blotting tape to prevent adhesive from curing on the dispensing tip.

      The dispensing head consists of a motor/lead screw assembly 7
which drives a plunger 8 to dispense adhesive on the dispensing tip 9
(see Fig. 2).  The syringe body 10 and dispensing tip are designed to
prevent air entrapment.  They are plastic injection molded to reduce
adhesive curing, cost (throw-away), and adhesive separation. The
syringe body and tip are designed to prevent air entrapment during
filling.

      The process sequence is:
      1.  Vision system takes picture of dispensing tip.
      2.  Dispense adhesive on tip.
      3.  Take picture and calculate amount of adhesive and compare
to process limits.
      4.  Apply adhesive to slider.
      5.  Take picture and measure remaining adhesive on...