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Avoiding Undesired Metal Depositions on Planarized Ceramic Surfaces by Specific Organofluorosilane and Polysiloxane Emulsions, Respectively

IP.com Disclosure Number: IPCOM000122675D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 47K

Publishing Venue

IBM

Related People

Druschke, F: AUTHOR [+3]

Abstract

Undesired metal, in particular undesired nickel, depositions below or on the ceramic surface during electroless metallization or nickel plating are readily avoided by the method described in this article.

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Avoiding Undesired Metal Depositions on Planarized Ceramic Surfaces
by Specific Organofluorosilane and Polysiloxane Emulsions, Respectively

      Undesired metal, in particular undesired nickel,
depositions below or on the ceramic surface during electroless
metallization or nickel plating are readily avoided by the method
described in this article.

      For wiring multilayer ceramic carriers, which is carried out
partly in thin-film technology on the module surface, the ceramic
carriers are planarized and polished after sintering.  During
planarization, surface defects occur or sinter pores are opened on
the surface.  When the vias are metallized, these defects or pores
lead to undesired nickel depositions below or on the planarized
ceramic surface.  To avoid such depositions, the planarized and
polished ceramic surface is treated with a long-chain
organofluorosilane or an aqueous polysiloxane emulsion and dried
prior to electroless nickel plating.
Example I:

      Planarized ceramic modules have half their surfaces immersed
for 5 minutes in a 1% xylene solution of a suitable
organofluorosilane, such as
tridecafluoro-1,1,2,2-tetrahydrooctyl-1-triethoxysilane. The test
modules are then stored in a vacuum, e.g., in an exsiccator, followed
by a drying or baking step at 150~ in a circulating air oven.  After
nickel plating, a microscopic inspection of the module surface halves
treated with organofluorosilane will show a 95 to 98% reduction in
undesired nickel...