Dismiss
InnovationQ will be updated on Sunday, Oct. 22, from 10am ET - noon. You may experience brief service interruptions during that time.
Browse Prior Art Database

Thick Film Deposition Separation Sequence

IP.com Disclosure Number: IPCOM000122692D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 62K

Publishing Venue

IBM

Related People

Andris, GS: AUTHOR [+2]

Abstract

Disclosed is a manufacturing method for a thick film deposition separation sequence. Prior thick film separation sequences caused pattern irregularities near the edge of the active pattern area where the paste nozzle 6 lifted from the screening mask 2. These irregularities were a result of adhesion characteristics between the conductive paste 3, the paste nozzle 6 and the screening mask 2. This new manufacturing method eliminates the effects of the conductive paste 3 adhesion, eliminates the pattern irregularities near the frame 4 boundaries and becomes more effective as the active pattern area approaches the frame 4 boundaries.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 68% of the total text.

Thick Film Deposition Separation Sequence

      Disclosed is a manufacturing method for a thick film
deposition separation sequence.  Prior thick film separation
sequences caused pattern irregularities near the edge of the active
pattern area where the paste nozzle 6 lifted from the screening mask
2.  These irregularities were a result of adhesion characteristics
between the conductive paste 3, the paste nozzle 6 and the screening
mask 2.  This new manufacturing method eliminates the effects of the
conductive paste 3 adhesion, eliminates the pattern irregularities
near the frame 4 boundaries and becomes more effective as the active
pattern area approaches the frame 4 boundaries.

      This new thick film deposition separation sequence is detailed
in Figs. 1A and 1B.  In Fig. 1A, screening mask 2 is attached to
frame 4.  During the thick film deposition operation, clamps 1 are in
closed position to secure the location of screening mask 2 while the
conductive paste carrier 5 is supported by structure 7.  The
conductive pattern is formed when the paste nozzle 6 traverses the
screening mask 2.

      The new separation sequence starts once the paste nozzle 6 has
traversed the screening mask 2 and the mask shock-absorbing system 8
is placed in the center of screening mask 2 as detailed in Fig. 1A.
Structure 7 with conductive paste carrier 5 then separates from the
screening mask 2 to start the new separation sequence.

      After a predetermined time inte...