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IBM RISC System/6000 Failure Analysis Process for Field Return Failures

IP.com Disclosure Number: IPCOM000122700D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 57K

Publishing Venue

IBM

Related People

Sumrell, CC: AUTHOR

Abstract

Disclosed is a process effective in determining root-cause failure analysis of field return electronic card assemblies. It focuses attention on the acquisition of pertinent customer data, i.e., customer configuration, software, and environment, prior to the actual debug of the assembly. The Failure Review Board is responsible for this information. In addition Guardband testing is used to stress the unit under evaluation to help identify the failure and confirm its fix.

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IBM RISC System/6000 Failure Analysis Process for Field Return Failures

      Disclosed is a process effective in determining
root-cause failure analysis of field return electronic card
assemblies. It focuses attention on the acquisition of pertinent
customer data, i.e., customer configuration, software, and
environment, prior to the actual debug of the assembly. The Failure
Review Board is responsible for this information. In addition
Guardband testing is used to stress the unit under evaluation to help
identify the failure and confirm its fix.

      Most failure analysis processes concentrate on the debug of the
electronic cards before considering the customer factors that result
in mispulls, erroneous or nonexistent failure data, and incomplete or
improper corrective actions. The end result is high No-Defect-Found
rates.

      The IBM RISC System/6000* Failure Analysis Process establishes
a Failure Review Board, reference (1) of the figure, with the
responsibilities of acquiring the proper information to duplicate the
failure, understanding the order in which the assembly or assemblies
were removed, and any uncontrollable external factors that may
restrict complete corrective actions.

      The process also uses Guardbanding, reference (2) of the
figure, as a failure analysis tool to assist in the identification of
environmentally sensitive assemblies. These assemblies are operated
under conditions beyond the normal customer specifications but within
c...