Browse Prior Art Database

Conductive Thin Film Solder Repair Process

IP.com Disclosure Number: IPCOM000122739D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 30K

Publishing Venue

IBM

Related People

Bowne, CP: AUTHOR [+2]

Abstract

Disclosed is a process for repairing conductive thin films using a transparent medium (quartz) with an attached solder ball to be aligned and heated using Infrared Radiation.

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Conductive Thin Film Solder Repair Process

      Disclosed is a process for repairing conductive thin films
using a transparent medium (quartz) with an attached solder ball to
be aligned and heated using Infrared Radiation.

      In the figure, the partitioned thin film line on top of the
biased substrate is repaired using solder.  A transparent media
(quartz) with an attached solder ball of specified dimensions,
depending on the size of the break, allows for proper alignment over
the thin film line with the use of any optics system.  Once the
quartz is in place, an infrared heat source can then be used to raise
the temperature of the solder up to liquidus.  The cohesive
properties of the solder allow it to then neutralize from the quartz
and wet to the conductive thin film line.

      Disclosed anonymously.