Browse Prior Art Database

Alignment Fixture for MCM Assembly

IP.com Disclosure Number: IPCOM000122765D
Original Publication Date: 1991-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 32K

Publishing Venue

IBM

Related People

Horton, RR: AUTHOR [+3]

Abstract

This invention allows multiple interconnection structures to be assembled with a common fixture for oven reflow to a silicon Multi-Chip Module (MCM) substrate. An important consideration when using a template type fixture is to match the thermal characteristics of the template to the substrate. By using <100> silicon that is anisotropically etched to align first level packages to a silicon MCM, the thermal match is assured. Furthermore, etched silicon is extremely accurate and competitive economically with any other suitable fixturing material.

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Alignment Fixture for MCM Assembly

      This invention allows multiple interconnection structures to be
assembled with a common fixture for oven reflow to a silicon
Multi-Chip Module (MCM) substrate. An important consideration when
using a template type fixture is to match the thermal characteristics
of the template to the substrate. By using <100> silicon that is
anisotropically etched to align first level packages to a silicon
MCM, the thermal match is assured.  Furthermore, etched silicon is
extremely accurate and competitive economically with any other
suitable fixturing material.

      The drawing is a cross section of the fixture showing a MCM
with two TAB packages and a chip which is to be flip-chip attached
using solder C4 for interconnections. The included angles in the
component wells align each component to the MCM while the frame is
aligned to the MCM using the same technique.

      Disclosed anonymously.