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Circuit Pattern for Outline Profiling on Printed Circuit Board

IP.com Disclosure Number: IPCOM000122777D
Original Publication Date: 1998-Jan-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 23K

Publishing Venue

IBM

Related People

Ohsumi, K: AUTHOR

Abstract

Disclosed a circuit pattern for outline profiling on a Printed Circuit Board (PCB) which presents the resin crack of the liquid resist layer at card profiling. The circuit pattern runs parallel alongside card outline against insulator crack and solder resist crack, which is broken out by die set profiling, etc., as shown in the Figure. This resin crack causes a circuit open by heat stress and copper ion migration by chemical residue.

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Circuit Pattern for Outline Profiling on Printed Circuit Board

      Disclosed a circuit pattern for outline profiling on a Printed
Circuit Board (PCB) which presents the resin crack of the liquid
resist layer at card profiling.  The circuit pattern runs parallel
alongside card outline against insulator crack and solder resist
crack, which is broken out by die set profiling, etc., as shown in
the Figure.  This resin crack causes a circuit open by heat stress
and copper ion migration by chemical residue.