Browse Prior Art Database

Heating Method of Ball Grid Array Module Rework

IP.com Disclosure Number: IPCOM000122800D
Original Publication Date: 1998-Jan-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 41K

Publishing Venue

IBM

Related People

Ohkuma, H: AUTHOR [+3]

Abstract

Disclosed is a heating method for reworking a Ball Grid Array (BGA) module soldered onto a Printed Circuit Board (PCB). Generally, the PCB is heated from both front and back sides to melt the solder joints during BGA module rework (remove/reflow) operation.

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Heating Method of Ball Grid Array Module Rework

      Disclosed is a heating method for reworking a Ball Grid Array
(BGA) module soldered onto a Printed Circuit Board (PCB).  Generally,
the PCB is heated from both front and back sides to melt the solder
joints during BGA module rework (remove/reflow) operation.

      Current back side heating methods are hot gas heating and
infrared radiation heating.  With those heating methods, it is hard
to keep the flatness of the PCB during BGA module rework operation
due to the uneven thermal distribution of the PCB.  On the other
hand, this invented heating method using heated liquid (Figure) from
the back  side of the PCB is effective to get even thermal
distribution of an assembled PCB.