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Browse Prior Art Database

Head Disk Assembly Arm Electronics Preheat for Power-Up Track MisRegistration Offset Reduction

IP.com Disclosure Number: IPCOM000122880D
Original Publication Date: 1998-Jan-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 25K

Publishing Venue

IBM

Related People

Su, R: AUTHOR

Abstract

Head Disk Assembly (HDA) data track MisRegistration offset with respect to where the track was written can be quite large at initial power-up conditions. This is due to the time needed for the mechanical system to thermally stabilize-both the spindle assembly and the actuator head-arm assembly. In the case where a significant heat source is located on the arm, such as an arm electronics module, the overall offset can be reduced by powering on the module but not the spindle assembly at the time of system power-on. The absence of the spindle rotation eliminates any forced convection cooling from the head-arm to rapidly approach a thermal state equivalent to steady state operating conditions.

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Head Disk Assembly Arm Electronics Preheat for Power-Up Track MisRegistration
Offset Reduction

Head Disk Assembly (HDA) data track MisRegistration offset with
respect to where the track was written can be quite large at initial
power-up conditions.  This is due to the time needed for the
mechanical system to thermally stabilize-both the spindle assembly
and the actuator  head-arm assembly.  In the case where a significant
heat source is located on the arm, such as an arm electronics module,
the overall offset  can be reduced by powering on the module but not
the spindle assembly at  the time of system power-on.  The absence of
the spindle rotation eliminates any forced convection cooling from
the head-arm to rapidly approach a thermal state equivalent to steady
state operating conditions.  By adjusting the length of arm pre-heat
time prior to turning on the spindle, the desired data head offset
can be adjusted to  optimum performance objectives.