Browse Prior Art Database

High Speed Arm Electronics Packaging on Actuator

IP.com Disclosure Number: IPCOM000122904D
Original Publication Date: 1998-Jan-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 40K

Publishing Venue

IBM

Related People

Satoh, K: AUTHOR [+3]

Abstract

Disclosed is a structure for use in Hard Disk Drives (HDDs). The preamplifier IC or the Arm Electronics (AE) is attached to the flex cable by flip chip attachment. The backside of the IC and actuator are connected by heat conductive material and, therefore, reduces the temperature in the IC.

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High Speed Arm Electronics Packaging on Actuator

      Disclosed is a structure for use in Hard Disk Drives
(HDDs).  The preamplifier IC or the Arm Electronics (AE) is attached
to the flex cable by flip chip attachment.  The backside of the IC
and actuator are connected by heat conductive material and,
therefore, reduces the temperature in the IC.

      The AE is a circuit in which the read and write signals in
the HDD are amplified and transferred to the magnetic heads.  In high
performance HDDs where the data rates are high, this IC is placed on
the actuator so that the distance from the heads are minimized.  To
make this possible, various Direct Chip Attach (DCA) methods are used
to shrink the size of the IC package.  The temperature rise due to
the fast data transfers is a major problem since the reliability of
the IC  deteriorates at very high temperatures.

      Recently, the flip chip attachment is available on flexible
cables.  In this method, the pads on the chip are faced down and the
small gap between the flex cable and chip is filled with
encapsulant.  Current designs use wire-bonding for DCA.  In this
method, the chip and connecting wires are entirely covered by
encapsulant bond  to protect the very thin wires.  This encapsulant
reduces the heat transfer of the chip.

      The Figure shows the brief structure of the invention.  A
metallic spring is inserted between the actuator carriage and the IC
chip.  In this way, heat is effe...