Browse Prior Art Database

Landless Photo Via Structure by Resist Fill-In Plated Hole

IP.com Disclosure Number: IPCOM000122917D
Original Publication Date: 1998-Jan-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 33K

Publishing Venue

IBM

Related People

Takagi, T: AUTHOR

Abstract

Disclosed is a Landless Photo via Structure by Resist Fill-in Plated Hole on a Printed Circuit Board (PCB) which enables production of high density build-up carriers. Most conventional patterning methods require Etching Resist on via Land in addition to the top of circuit wiring patterns. This method eliminates Etching Resist from the top of Via Lands by filling unsolvable Resist material into Plated via Hole instead of Etching Resist lamination. The diameter of Via Lands can be minimized by utilizing this method, since Via Land Rims, which prevent Etching void caused by Mis-registration, are not necessary.

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Landless Photo Via Structure by Resist Fill-In Plated Hole

      Disclosed is a Landless Photo via Structure by Resist Fill-in
Plated Hole on a Printed Circuit Board (PCB) which enables production
of high density build-up carriers.  Most conventional patterning
methods require Etching Resist on via Land in addition to the top of
circuit wiring patterns.  This method eliminates Etching Resist from
the top of  Via Lands by filling unsolvable Resist material into
Plated via Hole instead of Etching Resist lamination.  The diameter
of Via Lands can be  minimized by utilizing this method, since Via
Land Rims, which prevent  Etching void caused by Mis-registration,
are not necessary.

The Figure shows the typical manufacturing flow of a PCB which adopts
this method.