Browse Prior Art Database

SMT Pad of Power Connector for Reducing Assembling Defects and Fitting Power Circuit

IP.com Disclosure Number: IPCOM000123039D
Original Publication Date: 1998-Apr-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 93K

Publishing Venue

IBM

Related People

Kodama, S: AUTHOR [+2]

Abstract

This article describes Surface Mount Technology (SMT) pad of power connector for reducing assembling defects and fitting power circuit.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 57% of the total text.

SMT Pad of Power Connector for Reducing Assembling Defects and Fitting
Power Circuit

      This article describes Surface Mount Technology (SMT) pad of
power connector for reducing assembling defects and fitting power
circuit.

      Past power connector was almost PIH (pin in hole) type as for
the personal computer.  And that power connector can pass a lot of
electric current per one pin.  Therefore the size of connector is
relatively big.  However recently the personal computer would be that
body is thin and compact.  As for Note Book PC, the power connector
also become thin and compact.  The mother board that the SMT power
connectors mount is high density and miniaturized.  And the SMT power
connector that is compact, having a large number of pin and fine
pitch such as 0.5 mm or 0.8 mm is mainly used.  So, in the case of
past SMT pads on the mother board, the leads of the power connector
peel off from SMT pads when strong force is added to joint points
with solder.  And if the pads become large to increase the
anti-exfoliation, Suitable back fillet will not be made at solder
joint area on the pads.  That cause to increase assembly defects.

      The object of this invented SMT Pad, that can improve:
  - To increase the anti-exfoliation of connector leads.
  - To strengthen Power and ground (GND) circuit.
  - To decrease assembling defects (solder bridge) at the
     connector bottom.

  This invention integrate each Power pads and each GND pa...