Browse Prior Art Database

Peripheral Component Interconnect Tailstock Design For Enhanced Cooling

IP.com Disclosure Number: IPCOM000123050D
Original Publication Date: 1998-Apr-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 29K

Publishing Venue

IBM

Related People

Qualters, KR: AUTHOR

Abstract

Disclosed is a tailstock design to improve the cooling capabilities of cards built to Peripheral Component Interconnect (PCI) Industry Standards.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 100% of the total text.

Peripheral Component Interconnect Tailstock Design For Enhanced Cooling

      Disclosed is a tailstock design to improve the cooling
capabilities of cards built to Peripheral Component Interconnect
(PCI) Industry Standards.

      The cooling enhancements described in this publication are
enabled by perforating the tailstock.  As depicted in the figure, the
perforation creates a low thermal impedance in which the air can pass
across the card and exhaust via the tailstock.  The perforation
pattern is kept small and dense so as to maximize airflow while also
protecting against electromagnetic noise and/or susceptibility.

        As embodied in the figure, the entire tailstock can be
perforated for cards with no external interfaces.  The perforation
pattern is tailored around the tailstock apertures required for cards
with external connectors.