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An Interconnect Scheme and Process for Silicon Chips on a Silicon Carrier

IP.com Disclosure Number: IPCOM000123193D
Original Publication Date: 1998-Jun-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 2 page(s) / 60K

Publishing Venue

IBM

Related People

Druschke, DF: AUTHOR [+4]

Abstract

This article describes an optimized scheme for adhering chips, for the "gap-filling process" and the mounting of a planar dielectric on the chips as an optimum prerequisite for the electrical interwiring of these chips.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 53% of the total text.

An Interconnect Scheme and Process for Silicon Chips on a Silicon
Carrier

   This article describes an optimized scheme for adhering
chips, for the "gap-filling process" and the mounting of a planar
dielectric on the chips as an optimum prerequisite for the
electrical interwiring of these chips.

   The scheme and the process sequence are shown in the
Figure.  Fig. 1a depicts the silicon carrier after having
established the structures where the chips are inserted later on.
These structures are placed by means of lithographic processes and
using wet or dry etching methods.  Their depth can amount from some
tens of micrometers up to about the chip thickness.

   An adhesive is now applied onto this carrier substrate
(not shown in the Fig.).  From an economic point of view, spin
coating is preferred.

   The adhesive (EPO-TEK 358 ND  from Polytec) is mixed with
a solvent in the ratio of one to one and is spun on at 2000 rpm for
45 seconds.  A conformal layer results which, however, is still
workable for some minutes.  This is an important demand since several
hundreds of chips still have to be applied to the carrier.  After
having applied these chips, the adhesive is hardened for one hour in
a forced-air oven at 150oC.

   As shown in Fig. 1b, a layer of polyimide (PI 5878 from
Beck) is applied on the surfaces of the chips and the remaining free
carrier material, also by spin coating, after the hardening of the
adhesive.

   Inspite of the topographic differences...