Browse Prior Art Database

Thermoelectric Temperature Forcing Probe

IP.com Disclosure Number: IPCOM000123350D
Original Publication Date: 1998-Oct-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 43K

Publishing Venue

IBM

Related People

Bailis, RT: AUTHOR

Abstract

Disclosed is a device that can precisely heat or cool a component or localized area to determine its failure temperature.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 75% of the total text.

Thermoelectric Temperature Forcing Probe

   Disclosed is a device that can precisely heat or cool a
component or localized area to determine its failure temperature.

   In past experience, it has been observed that many
products had temperature related problems.  It is very hard to
determine which component(s) cause the problem using conventional
test methods such as spray Freon and/or heat gun.  Heating the
component with a heat gun heats the surrounding components.
Similarly, cooling the component with spray Freon cools the
surrounding components, thus making it difficult to cool or heat a
single component or a specific area to determine the temperature at
which the failure occurs.  An addition concern is that Freon is an
environmental hazard.

   The Thermoelectric Temperature Forcing Probe heats and
cools the surface of a single component or localized area.  It uses a
solid state heat pump (Thermoelectric Cooler, TEC) that has no moving
parts and does not contain Freon.  By controlling the magnitude and
direction of the current through the TEC, it heat or cool a surface.

   The two major components of the Thermoelectric Temperature
Forcing Probe are the thermoelectric probe and the power control
unit.  The thermoelectric probe (probe for short) is where the
physical contact is made to the suspected component.  It contains a
TEC and a water cooled heat sink.  The water is kept at room
temperature by the means of a small pump, water reservoir and heat
exchan...