Browse Prior Art Database

Overmold Headbeam Assembly

IP.com Disclosure Number: IPCOM000123488D
Original Publication Date: 1998-Dec-01
Included in the Prior Art Database: 2005-Apr-04
Document File: 1 page(s) / 31K

Publishing Venue

IBM

Related People

Hu, PY: AUTHOR [+3]

Abstract

A headbeam assembly is used to position a magnetic head against the recording media (not shown) to access various recording tracks. In order to move the headbeam assembly, there is a coil assembly that is integral part of the headbeam assembly. The coil is to be immersed in the appropriate magnetic fields (not shown) and linear motion force will be generated when an electrical current is applied to the coil.

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Overmold Headbeam Assembly

   A headbeam assembly is used to position a magnetic head
against the recording media (not shown) to access various recording
tracks.  In order to move the headbeam assembly, there is a coil
assembly that is integral part of the headbeam assembly.  The coil is
to be immersed in the appropriate magnetic fields (not shown) and
linear motion force will be generated when an electrical current is
applied to the coil.

   This invention involves an electrical coil, which is
overmolded into the headbeam structure.  The plastic will secure the
coil firmly into the headbeam, with plastic covering the outer as
well as the inner peripheries of the coil but not the sides of the
coil.  In other words, the plastic material flows to either inside
and outside of the coil.  The inside plastic positions the coil in
the headbeam structure, whereas the plastic on the outside of the
coil anchors the coil against the beam.  The combination produces the
highest strength coil structure for vibration frequency response.
There are no plastics on the side of the plastic for proper heat
transfer through convection.