Browse Prior Art Database

Device for Preventing Circuit Panel Warpage

IP.com Disclosure Number: IPCOM000123754D
Original Publication Date: 1999-Apr-01
Included in the Prior Art Database: 2005-Apr-05
Document File: 5 page(s) / 137K

Publishing Venue

IBM

Related People

Okabe, S: AUTHOR [+2]

Abstract

Disclosed is a method and tool for preventing circuit panel warpage which is seen after post curing in the solder resist coating process.

This text was extracted from an ASCII text file.
This is the abbreviated version, containing approximately 64% of the total text.

Device for Preventing Circuit Panel Warpage

   Disclosed is a method and tool for preventing circuit
panel warpage which is seen after post curing in the solder resist
coating process.

   This warpage is caused from the solder resist shrinkage
after its post curing and warpage repair process is needed before
shipping products in order to meet the flatness quality requirement.
But it is quite difficult to flatten panels warped once and moreover
it becomes clear that the flattened products by the current method
returns gradually toward to the originally warped state.  And also
this repair process needs a lot of time.  The current repair method
for the warpage repair process is as shown in Figure 1.

   Therefore an improved method for preventing circuit panel
warpage is proposed that flattens panels by utilizing solder resist
curing.  This mechanism is based on flattening panels by holding only
the panel work area with work-area support tools that should be made
of hard material like stainless steal.  This method is in line
process and finally warpage repair process before shipping products
can be eliminated.

   The post cure process steps with the work-area support
tools are as follows:
  1) Hold coated panel with solder resist between work-area
     support tools as shown in Figure 2.
  2) Fix upper and lower work-area support tools.
  3) Repeat 1) and 2) necessary number of times and insert them
     into exclusive holders.
  4) Hold them in post cure...