Browse Prior Art Database

COG Structure for LCD Module

IP.com Disclosure Number: IPCOM000123982D
Original Publication Date: 1999-Sep-01
Included in the Prior Art Database: 2005-Apr-05
Document File: 2 page(s) / 89K

Publishing Venue

IBM

Related People

Sakamoto, K: AUTHOR

Abstract

Disclosed is a Chip On Glass (COG) LCD module structure which improves the reliability and the manufacturing yield by modifying the Anisotropic Conductive Film (ACF) usage for IC and FPC connections. Figure-1 shows the module overview and figure-2 shows the magnified sectional view of driver IC and FPC connection area. Driver IC is mounted on the outside of the display area and its required input signals are provided by FPC. Both driver IC and FPC are connected by ACF. Figure-3 shows the plane view of the Driver IC and FPC connection area of the conventional COG module while figure-2 shows that of disclosed COG module. As summarized in following table, conventional module uses the 2 kind of ACF, one for driver IC connection (both IC output and IC input) and another for FPC.

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COG Structure for LCD Module

   Disclosed is a Chip On Glass (COG) LCD module structure
which improves the reliability and the manufacturing yield by
modifying the Anisotropic Conductive Film (ACF) usage for IC and FPC
connections.  Figure-1 shows the module overview and figure-2 shows
the magnified sectional view of driver IC and FPC connection area.
Driver IC is mounted on the outside of the display area and its
required input signals are provided by FPC.  Both driver IC and FPC
are connected by ACF.  Figure-3 shows the plane view of the Driver IC
and FPC connection area of the conventional COG module while figure-2
shows that of disclosed COG module.  As summarized in following
table, conventional module uses the 2 kind of ACF, one for driver IC
connection (both IC output and IC input) and another for FPC.
Disclosed module uses also 2 kind of ACF, however ACF(1) covers only
IC output connection and ACF(2) covers both IC input and FPC output
connection.  Since there is a different requirement on connection
pitch and allowable resistance change between IC output and IC
input/FPC output, disclosed module can select the most proper ACF for
each connection from the view point of connection reliability and
manufacturing easiness.  Current advanced equipment can place ACF in
proper accuracy which is key success factor for disclosed module
structure.