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Method for a two-piece deposition ring for a CBS Ta chamber

IP.com Disclosure Number: IPCOM000124063D
Publication Date: 2005-Apr-07
Document File: 2 page(s) / 75K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a two-piece deposition ring for a cooper barrier seed (CBS) tantalum (Ta) chamber. Benefits include improved functionality and improved performance.

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Method for a two-piece deposition ring for a CBS Ta chamber

Disclosed is a method for a two-piece deposition ring for a cooper barrier seed (CBS) tantalum (Ta) chamber. Benefits include improved functionality and improved performance.

Background

              The Ta deposition chamber on the CBS toolset experiences high temperature during the Ta deposition step. Tantalum is deposited on the wafer and, subsequently, on the parts surrounding the wafer pedestal. Ta buildup on parts causes blistering and delamination of their aluminum (Al) coating. As a result, the lifetime of the part is shortened due to particle generation that leads to malfunction of the machine and lower die yields on the product. Blistering/delamination has occurred in the kilowatt hour (KWHR) range of 560-750, which is below the goal of 1400 KWHR. The deposition ring is in close proximity to the wafer.

      Conventionally, the problem is solved by using a one-piece ceramic (Al2O3 substrate) deposition ring with an Al arc spray applied to the top surface. The ring is failing prematurely due to the delamination and blistering problems caused by Ta deposition. Typically, 85% of the blistering/delaminating observed, occurs after more than one cleaning/recycling (see Region 1, Figure 1).

General description

      The disclosed method is a two piece deposition ring for the CBS Ta deposition chamber. The

key elements of the method include:

•             Two-piece deposition ring with a titanium (Ti) piece and a ceramic piece

•             Use of the Ti piece as the substrate for the Al arc spray

•             Isolation of the Ti ring from the electrostatic chuck by the ceramic, enabling process...