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Method for an optical interconnect substrate

IP.com Disclosure Number: IPCOM000124064D
Publication Date: 2005-Apr-07
Document File: 2 page(s) / 54K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for an optical interconnect substrate. Benefits include improved functionality, improved performance, improved power performance, improved thermal performance, and improved reliability.

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Method for an optical interconnect substrate

Disclosed is a method for an optical interconnect substrate. Benefits include improved functionality, improved performance, improved power performance, improved thermal performance, and improved reliability.

Background

              Conventional lamination/laser drill and coating/photo lithograph/etching processes can deliver a concave pattern medium. Additionally, coating/lithograph/etching technology can fabricate the optical circuit on the concave medium. However, these processes do not apply to optical signal substrates, which are expected to be the basis for the optical chips and computer systems.

              Conventional metal circuits require electricity. Optical circuits require light, which is a cool signal and is more stable and faster.

General description

      The disclosed method formulates a nontransparent optical-circuit substrate with fiber-optic circuits. The process medium is a polymer material. The substrate has a concave pattern (via) achieved by laser or photolithograph/ultraviolet (UV)/thermal cure accompanied by an etching process. The substrate is coated with an optical material. After curing, a layer with an optical circuit line is fabricated. Each layer with an optical circuit is formed individually, not built up on the first layer.

              The key elements of the disclosed method include:

•             Polymer medium material that is coated or laminated on a very smooth panel, such as a wafer

•             Etch process that creates a concave pattern in the polymer medium

•             Optical material coating in the via in the polymer medium

•             Index of the circuit line material that decreases from the outside to the core side, avoiding the loss of the light passing in the line

•             Circuits that are formed on individual layers

Advantages

              The disclosed method provides advantages, including:
•             Impr...