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Method for a thermal-cured optical interconnection

IP.com Disclosure Number: IPCOM000124065D
Publication Date: 2005-Apr-07
Document File: 2 page(s) / 119K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for a thermal-cured optical (T-COC) interconnection. Benefits include improved functionality, improved power performance, improved thermal performance, and improved reliability.

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Method for a thermal-cured optical interconnection

Disclosed is a method for a thermal-cured optical (T-COC) interconnection. Benefits include improved functionality, improved power performance, improved thermal performance, and improved reliability.

Background

              Conventionally, interconnection is required on chips with layers on both side of the wafer and for stacked-die packages. The interconnection is achieved using metal circuits. However, conventional interconnection does not apply to optical signal circuits, which are expected to be the basis for the optical chips and computer systems.

              Conventional metal circuits require electricity. Optical circuits require light, which is a cool signal and is more stable and faster.

General description

             The disclosed method is a thermal-cured optical interconnection of multiple layers of optical circuits on optical substrates, chips, and waveguides. Additionally, the method provides optical substrate and chip connections. 

      Optical paste material is printed on a pad in a via on an optical substrate. A thermal-cure adhesive film is coated with convex fiber on the surface of the other chip/substrate/wave guide or the other layer to be connected. A convex fiber is inserted into the via. After thermal curing, the optical paste connects the two fibers. The adhesive film joins the two substrate/chip or layers.

              The key elements of the disclosed method include:

•             Optical material solution/paste that is printed in the concave pattern with the optical pad

•             Via and convex fiber alignment

•             Sol gel that connects with and becomes part of the fiber

Advantages

              The disclosed method provides advantages, including:
•             Improved functionality due to providing optical interconnection
•         ...