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Copper Electroplated Tools with Integrated Total Organic Content Monitor and Software-Driven Real-Time Feedback

IP.com Disclosure Number: IPCOM000124182D
Publication Date: 2005-Apr-11
Document File: 2 page(s) / 186K

Publishing Venue

The IP.com Prior Art Database

Abstract

Disclosed is a method for integrated total organic content (TOC) monitoring on copper electroplating tools, using software-driven, real-time feedback control of the feed/bleed rates. Benefits include eliminating defects in plated copper thin films.

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Copper Electroplated Tools with Integrated Total Organic Content Monitor and Software-Driven Real-Time Feedback

Disclosed is a method for integrated total organic content (TOC) monitoring on copper electroplating tools, using software-driven, real-time feedback control of the feed/bleed rates. Benefits include eliminating defects in plated copper thin films.

Background

The current process uses a high organic bath to enable gap fill on the 65nm node technology. It is likely that others in the industry will move to high organic baths to enable gap fill with copper electroplating. However, high organic baths (implying a bath with high TOC levels) is susceptible to missing copper defects.

To address this problem, the current method uses a forced bleed and feed to keep the TOC below the UCL, using a standalone TOC monitoring system. This approach, however, has no TOC control and is not conducive to high volume manufacturing.

General Description

The disclosed method integrates TOC monitoring on copper electroplating tools, using software-driven, real-time feedback control of the feed/bleed rates. The goal is to maintain the TOC of the electroplated bath below a predetermined threshold level (by adjusting the feed/bleed as required) to eliminate defects in plated copper thin films.

Advantages

The disclosed method eliminates defects in plated copper thin films.

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Disclosed anonymously